Yifeng (Ethan) Xiao 萧屹楓
EECS Ph.D. @ UC Berkeley · Neurosymbolic AI
Hi there! It’s Yifeng (Ethan). I am an EECS Ph.D. candidate at the University of California, Berkeley, advised by Prof. Pierluigi Nuzzo.
🤖 My research is on neurosymbolic AI: combining formal methods, machine learning, and game theory to design, verify, and synthesize systems that act in the world, from hardware design and cyber-physical systems (such as smart grids and robotics) to AI agents. I lead the development of CHASE, an open-source contract-based design toolkit that is the symbolic backbone of this work. Alongside my research, I co-founded a stealth startup that brings these ideas to production AI agents.
I received my B.E. in Microelectronic Science and Engineering from Fudan University (復旦大學), where I worked with Prof. Jianli Chen and Prof. Bei Yu on machine learning for electronic design automation (EDA).
💬 I enjoy connecting with researchers, engineers, and founders working on related problems, and I am open to collaborations and new opportunities. Feel free to reach out, or book 30 minutes with a quick note on what you’d like to discuss.
News
| Oct 29, 2026 | Gave a virtual presentation of ACIES at the REALM 2026 workshop at EMNLP 2026. The paper is now available in the ACL Anthology! 🎤 |
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| Oct 09, 2026 | Presented our paper on contract-based consistency and availability analysis for distributed cyber-physical systems at MEMOCODE 2026, part of ESWEEK 2026 in Barcelona, Spain! 🎤 |
| Sep 08, 2026 | Paper “ACIES: A Self-Evolving Agentic Contract-Based Framework for Cyber-Physical System Control Synthesis” accepted at the REALM 2026 workshop, co-located with EMNLP 2026 in Budapest, Hungary! 🎉 |
Selected Publications
Honors and Awards
- Best Paper Award , Design Automation and Test Conference in Europe 2024 (Top 0.4% of submissions) 2024
- DAC Young Fellowship , Design Automation Conference 2023
- Outstanding Graduates of Shanghai , Shanghai Municipal Government (Top 2%) 2020
- National IC Design Competition - First Prize for Undergraduate Group , National IC Design Competition 2019
- Undergraduate Excellence Scholarship of FDU , Fudan University 2018
- SCSK Corporation Scholarship , SCSK Corporation (Top 1%) 2018